2017 APPMA Scholarship Winner

2017 APPMA Scholarship Winner
October 18, 2017 Ivan Hong
In Awards

Source: PIDA – Auspack

The APPMA, in conjunction with the AIP, are offering the ninth annual scholarship program which will enable a one person the opportunity to complete a Diploma in Packaging Technology valued at $9,000. The Diploma in Packaging Technology prepares students to take responsibility for packaging operations at any level through the supply chain. The qualification is internationally recognised, comprehensive, and provides an opportunity to study the principles of packaging, packaging materials and packaging processes.

Finalists are: Nelson Bulsari, Technical Director, Roto Converters NZ, Liz Cagorski, Brand Custodian Packaging Specialist, Liza Rose design and communications, John Ferrier, Quality Manager, Campari, Claire Lee, Packaging Quality Coordinator, LION and Michael Van Dord, Technical and Design Engineer, Caps and Closures.

The judges reviewed all written applications and were impressed with the packaging technologists who wished to advance their knowledge through the AIP Diploma in Packaging Technology course. The challenge is always selection amongst such great talent.

The Winner is

Michael Van Dord, Technical and Design Engineer, Caps and Closures. Michael Van Dord also has a design background since moving over from Aerospace engineering and has moved into project engineering across many applications of caps and closures with numerous FMCG companies. He also has a passion for education and has already conducted lectures on packaging related matters.

In Michael’s own words “As my understanding of the packaging world grows so does the realisation that I have only scratched the surface of the full design cycle within the vast category that is packaging. I am excited by the prospect of becoming a specialist within packaging and expanding my knowledge base within injection moulded closures and delving into areas of packing that I have not had experience within. I look forward to building on my skill set and through my link with the AIP sharing my knowledge and experience with the broader packaging community.”

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